Intel Corp. on Monday, 25 July, 2005, announced plans to begin production of their microprocessors built on 45nm process technology in the second half of 2007. These chips will be produced from a new 300mm wafer fabrication facility at its site in Chandler, Arizona, which designated as Fab 32.

The announcement not only shed some light to the new microprocessors technology, it brought good news to the job market too. The new facility will create up to 1000 new Intel jobs at the Arizona site over the next several years too. This is because even during the construction phase, more than 3000 skilled trades people will be hired to work on the project. Once completed, Fab 32 will become Intel’s sixth 300mm wafer facility.

By the way, one of the benefits of producing chips from 300mm wafer is to reduce the cost of production. The bigger wafers lower the production cost per chip while diminishing overall use of resources, for instance, 300mm wafer manufacturing uses 40% less energy and water per chip than a 200mm wafer factory.

Quoted:
Manufacturing with 300mm wafers increases the ability to produce semiconductors at a lower cost compared with more widely used 200mm wafers. The total silicon surface area of a 300mm wafer is 225% more than that of a 200mm wafer, and the number of printed die (individual computer chips) is increased to 240%, according to Intel.