We have seen the introduction dual core processors, first Advanced Micro Devices (AMD) Opteron, then come Intel Pentium Extreme Edition 840.

Intel’s vision of a future chip design which are moves that are necessary to improve overall system performance as the chipmaker packs more cores onto a single chip.

The new head of Intel’s Corporate Technology Group, Justin Rattner, described Intel’s evolving vision of what its chips might look like around 2015 in an interview at Intel headquarters Thursday. Intel, like much of the chip industry, has decided that multicore designs are the way to go to improve performance in the future.

Some the early fruits of Intel’s project are evident in Intel’s I/O Acceleration Technology, announced earlier this year at the Spring Intel Developer Forum, Rattner said. This technology essentially improves the I/O performance of Intel chips by dedicating excess processing resources to I/O functions. It will be available next year with Intel’s first dual-core Xeon server chip, code-named Dempsey.

However, Intel is urged to move away from its frontside bus design by analysts and customers due to the advent of multicore processors. This is because in Intel’s current chips, the interaction between the processor and a system’s memory bank is handled by a memory controller on the chip set that feeds data to the processor at various speeds ranging from 400 MHz to 1066 MHz, depending on the chip. This design has served the company well for many years, but as chips start to take advantage of multiple processing units, they require increased amounts of memory bandwidth to perform to their true potential.

Some aspects of moving away from its frontside bus designs will start to become possible as Intel introduces its 45-nanometer and 32-nanometer processing technologies, which will be capable of producing smaller transistors than Intel’s current 90-nanometer processing technology, Rattner said. At the moment, those introductions are scheduled for 2007 and 2009.

45nm & 32nm ?? :-O